据悉,可穿戴AI硬件Nirva完成数千万元元种子轮融资,由美国VC光速(Lightspeed)领投,South Park Commons跟投。此次融资主要用来扩充团队、量产准备和新品研发。
![]()
特别声明:以上内容(如有图片或视频亦包括在内)为自媒体平台“网易号”用户上传并发布,本平台仅提供信息存储服务。
Notice: The content above (including the pictures and videos if any) is uploaded and posted by a user of NetEase Hao, which is a social media platform and only provides information storage services.